1

Thermal analysis of a multi-chip package design

Year:
1989
Language:
english
File:
PDF, 809 KB
english, 1989
6

A thermal module design for advanced packaging

Year:
1987
Language:
english
File:
PDF, 1.23 MB
english, 1987
7

A high-performance thermal module for computer packaging

Year:
1987
Language:
english
File:
PDF, 793 KB
english, 1987
8

Deformation and fracture behavior of Sn-5%Sb solder

Year:
1994
Language:
english
File:
PDF, 594 KB
english, 1994